Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Copper alloy sputtering target and semiconductor element wiring

Copper alloy sputtering target and semiconductor element wiring

US Patent 7507304 · Granted Mar 24, 2009

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Tungsten silicide target member and method for manufacturing same, and method fo2025
Method of manufacturing steering shaft2024
Copper alloy sputtering target and semiconductor element wiring2020
Copper alloy sputtering target and semiconductor element wiring2020
Tungsten sintered compact sputtering target and tungsten film formed using same 2018
Copper alloy sputtering target and method for manufacturing the target2018
Copper alloy sputtering target and method for manufacturing the target2018
Tungsten sintered compact sputtering target and method for producing same2017
High-purity copper sputtering target2017
Copper alloy sputtering target, process for producing the same and semiconductor2017
Sputtering target and manufacturing method therefor2017
Sputtering target, sputtering target-backing plate assembly and deposition syste2017