Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Lead frame with included passive devices

Lead frame with included passive devices

US Patent 7489021 · Granted Feb 10, 2009

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Block classified term2021
Low pressure encapsulant for size-reduced semiconductor package2017
Ultrathin flip-chip packaging techniques and configurations2016
Wafer level package with embedded passive components and method of manufacturing2014
Sheet-molded chip-scale package2013
Substrateless package2011
Semiconductor device package and method for manufacturing same2009
Thermal enhanced package for block mold assembly2007
Thin multiple semiconductor die package2007
Thin multiple semiconductor die package2007
Laser defined pads for flip chip on leadframe package fabrication method2003
Laser defined pads for flip chip on leadframe package2003