Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Modularized die stacking system and method

Modularized die stacking system and method

US Patent 7485951 · Granted Feb 3, 2009

Estimated economic value: $388,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Server rack system latch lockout2025
Enclosure for a cable connection2018
Enclosure for a cable connection2017
Enclosure for a cable connection2014
High density IC module2010
Modified core for circuit module system and method2010
Circuit module with thermal casing systems2010
Circuit module with thermal casing systems2010
Stacked modules and method2010
Stacked module systems2010
Stacked module systems2010
Heat sink for a high capacity thin module system2009