Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Heat sink for a high capacity thin module system

Heat sink for a high capacity thin module system

US Patent 7626259 · Granted Dec 1, 2009

Estimated economic value: $512,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Enclosure for a cable connection2018
Communicating information relating to a network resource2018
Flex over suspension fault detection under a write gate for magnetic disk drives2017
Enclosure for a cable connection2017
Communicating information relating to a network resource2014
Enclosure for a cable connection2014
Client-side processing of preload operations2014
Server-side suggestion of preload operations2014
System, apparatus and method for cooling electronic components2013
Proximity sensing system2013
System, apparatus and method for cooling electronic components2013
Proximity sensing system2013