Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for making flip chip on leadframe package

Method for making flip chip on leadframe package

US Patent 7425468 · Granted Sep 16, 2008

Estimated economic value: $498,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device with capping layer2025
Method for fabricating semiconductor device with multi-carbon-concentration diel2025
Semiconductor device with air gap and method for preparing the same2025
Semiconductor device with porous layer and method for fabricating the same2025
Semiconductor structure with anti-back-sputter layer2025
Method for manufacturing memory device having a protruding channel structure2025
Semiconductor device structure including composite interconnect2025
Sol-gel vaults and methods of making and using thereof2025
Composite interconnect semiconductor device structure2025
Heat sink and communication device2025
Semiconductor device package and method for manufacturing the same2025
Heat sink and communication device2025