Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and apparatus for treating wafer edge region with toroidal plasma

Method and apparatus for treating wafer edge region with toroidal plasma

US Patent 7404874 · Granted Jul 29, 2008

Estimated economic value: $9,815,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Chemical oxide removal of plasma damaged SiCOH low k dielectrics2012
Chemical oxide removal of plasma damaged SiCOH low k dielectrics2012
Chemical oxide removal of plasma damaged SiCOH low k dielectrics2008
Chemical oxide removal of plasma damaged SiCOH low k dielectrics2008
Integrated dual damascene RIE process with organic patterning layer2006
Integrated dual damascene RIE process with organic patterning layer2006
Slurry for chemical mechanical polishing silicon dioxide2006
Method for reactive ion etch processing of a dual damascene structure2005
Slurry for chemical mechanical polishing silicon dioxide2003
Slurry for chemical mechanical polishing silicon dioxide2003
Slurry for chemical mechanical polishing silicon dioxide2002
Image sensor having improved spectral response uniformity2002