Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Electronic package with epoxy or cyanate ester resin encapsulant

Electronic package with epoxy or cyanate ester resin encapsulant

US Patent 7384682 · Granted Jun 10, 2008

Estimated economic value: $5,963,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electrically conductive adhesive (ECA) for multilayer device interconnects2016
Circuitized substrate with low loss capacitive material and method of making sam2013
Encapsulant of epoxy or cyanate ester resin, reactive flexibilizer and thermopla2009
Electrically conducting adhesives for via fill applications2008
Method and structure for producing Z-axis interconnection assembly of printed wi2008
Encapsulant composition and electronic package utilizing same2008
Encapsulant composition and electronic package utilizing same2007
Solid via layer to layer interconnect2006
Cap attach surface modification for improved adhesion2006
Semiconductor device having a thermoset-containing dielectric material and metho2006
Formation of multisegmented plated through holes2006
Method of making and interconnect structure2005