Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and apparatus for decoupling conductive portions of a microelectronic device package

Method and apparatus for decoupling conductive portions of a microelectronic device package

US Patent 7378723 · Granted May 27, 2008

Estimated economic value: $2,289,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Build-up package for integrated circuit devices, and methods of making same2025
Build-up package for integrated circuit devices, and methods of making same2022
Packaged semiconductor components having substantially rigid support members2020
Packaged microelectronic devices and methods for manufacturing packaged microele2020
Build-up package for integrated circuit devices, and methods of making same2020
Computer modules with small thicknesses and associated methods of manufacturing2019
Electronic device assemblies including conductive vias having two or more conduc2019
Packaged semiconductor components having substantially rigid support members and2019
System in package (SIP) with dual laminate interposers2019
Computer modules with small thicknesses and associated methods of manufacturing2019
Microelectronic devices, stacked microelectronic devices, and methods for manufa2019
Packaged microelectronic devices and methods for manufacturing packaged microele2018