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Home › Method and apparatus for probing at arbitrary locations within an inaccessible array of leads the solder balls or pins actually connecting a VLSI IC package to a substrate or socket

Method and apparatus for probing at arbitrary locations within an inaccessible array of leads the solder balls or pins actually connecting a VLSI IC package to a substrate or socket

US Patent 7372284 · Granted May 13, 2008

Estimated economic value: $3,334,000 ⓘ

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