Issued Patents All Time
Showing 25 most recent of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9671427 | Dual output high voltage active probe with output clamping and associated methods | Edward Vernon Brush, IV | 2017-06-06 |
| 9459290 | Oscilloscope system and method for simultaneously displaying zoomed-in and zoomed-out waveforms | Edward Vernon Brush, IV, Michael McTigue | 2016-10-04 |
| 9423422 | Oscilloscope probe having output clamping circuit | Edward Vernon Brush, IV, Michael McTigue | 2016-08-23 |
| 9316669 | Measurement probe providing different levels of amplification for signals of different magnitude | Michael McTigue, Edward Vernon Brush, IV | 2016-04-19 |
| 9304150 | Closed core current probe | — | 2016-04-05 |
| 9188606 | Oscilloscope current probe with interchangeable range and sensitivity setting modules | Edward Vernon Brush, IV | 2015-11-17 |
| 7965764 | Simultaneous physical and protocol layer analysis | Roland Gamper, Gilles Ritter, Lawrence Salant | 2011-06-21 |
| 7756199 | Simultaneous physical and protocol layer analysis | Roland Gamper, Gilles Ritter, Lawrence Salant | 2010-07-13 |
| 7531899 | Ball grid array package | — | 2009-05-12 |
| 7492173 | Probe accessories, and methods for probing test points using same | Brock J. LaMeres, Brent Holcombe | 2009-02-17 |
| 7403560 | Simultaneous physical and protocol layer analysis | Roland Gamper, Gilles Ritter, Lawrence Salant | 2008-07-22 |
| 7371093 | ZIF connection accessory and ZIF browser for an electronic probe | — | 2008-05-13 |
| 7372284 | Method and apparatus for probing at arbitrary locations within an inaccessible array of leads the solder balls or pins actually connecting a VLSI IC package to a substrate or socket | Brent Holcombe, Brock J. LaMeres | 2008-05-13 |
| 7338292 | Board-to-board electronic interface using hemi-ellipsoidal surface features | Brock J. LaMeres | 2008-03-04 |
| D556066 | Housing for oscilloscope | Thomas Hoang, Matthew Evans, Christopher Busso, Tyler Cox | 2007-11-27 |
| 7242203 | Probe retention kit, and system and method for probing a pattern of points on a printed circuit board | Brock J. LaMeres, Brent Holcombe | 2007-07-10 |
| 7145352 | Apparatus, method, and kit for probing a pattern of points on a printed circuit board | Brock J. LaMeres, Brent Holcombe | 2006-12-05 |
| 7046020 | Probes with perpendicularly disposed spring pins, and methods of making and using same | Brock J. LaMeres, Brent Holcombe | 2006-05-16 |
| 7025628 | Electronic probe extender | Brock J. LaMeres | 2006-04-11 |
| 6980015 | Back side probing method and assembly | — | 2005-12-27 |
| 6638080 | Integrated ball grid array-pin grid array-flex laminate test assembly | Brent Holcombe | 2003-10-28 |
| 6169411 | Integrated circuit testing assembly and method | — | 2001-01-02 |
| 6144213 | Ball grid array probing technique | — | 2000-11-07 |
| 6144559 | Process for assembling an interposer to probe dense pad arrays | Thomas J. Zamborelli, Larry Bartosch | 2000-11-07 |
| 6030254 | Edge connector interposing probe | Thomas J. Zamborelli | 2000-02-29 |