Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Thermally enhanced molded package for semiconductors

Thermally enhanced molded package for semiconductors

US Patent 7361985 · Granted Apr 22, 2008

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Children's camera2025
Dynamic adaptation of parameter set used in hot word free adaptation of automate2025
Auricular vagus nerve stimulation device2025
Network rack of host server computers with increased network availability2025
Method for proteome-wide discovery of covalent ligands and compositions thereof2025
Automated assistant interaction prediction using fusion of visual and audio inpu2025
Optical devices and systems for optical source redundancy2025
Fireproof clothing2025
Surgical instrument and operation robot2025
Reconfigurable all-optical activation functions having normalized output power2025
Reconfigurable all-optical nonlinear activation functions on silicon-integrated 2025
Optical device including a grated optical waveguide to improve modulation effici2025