Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › High electrical performance semiconductor package

High electrical performance semiconductor package

US Patent 7361846 · Granted Apr 22, 2008

Estimated economic value: $10,247,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electronic package and manufacturing method thereof2025
Electronic package and manufacturing method thereof2025
Electronic package and manufacturing method thereof2025
Electronic package and manufacturing method thereof2025
Printed circuit board having a sacrificial pad to mitigate galvanic corrosion2025
Semiconductor structure and method for forming the same2025
Electronic package and manufacturing method thereof2024
Electronic package and manufacturing method thereof2024
Printed circuit board with stacked passive components2024
Printed circuit board for galvanic effect reduction2024
Semiconductor memory structure and method for forming the same2023
Bumped pad structure2023