Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Cold plate and mating manifold plate for IC device cooling system enabling the shipment of cooling system pre-charged with liquid coolant

Cold plate and mating manifold plate for IC device cooling system enabling the shipment of cooling system pre-charged with liquid coolant

US Patent 7336487 · Granted Feb 26, 2008

Estimated economic value: $16,748,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Triangular board assembly for solid state drive2025
Two phase immersion cooling system with useable warmed liquid output2025
Wafer support member and method of manufacturing a wafer support member2025
Blood pressure apparatus using active materials and related methods2023
Disposition of a workload based on a thermal response of a device2022
Techniques for use of a multipurpose latch2022
SSD temperature control technique2021
Crushable heat sink for electronic devices2021
Data portion allocation for temperature management of memory devices2020
Methods and apparatus to grasp an object with an unmanned aerial vehicle2020
Reduction of touchscreen bounce2020
Blood pressure apparatus using active materials and related methods2019