Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor wafer cutting blade and method

Semiconductor wafer cutting blade and method

US Patent 7306975 · Granted Dec 11, 2007

Estimated economic value: $32,534,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Device for marking a moulded or cast form2025
Chip warpage reduction via raised free bending and re-entrant (auxetic) trace ge2024
PCB structure for embedding electronic components2022
Method for fabricating a lid for a wafer level packaged optical MEMS device2005