Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor chip capable of implementing wire bonding over active circuits

Semiconductor chip capable of implementing wire bonding over active circuits

US Patent 7304385 · Granted Dec 4, 2007

Estimated economic value: $2,179,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Wooden newel with a clean surface and preparation method thereof2025
Electronic control actuator, exhaust gas treatment system, and vehicle comprisin2025
LDMOS transistor and manufacturing method thereof2025
Trench-type MOSFET and method for manufacturing the same2024
Diffusive gradients in thin films (DGT) test device for lake water and test meth2024
LDMOS transistor and method for manufacturing the same2023
Stylus holders2023
SiC MOSFET and method for manufacturing the same2023
Diffusive gradients in thin films (DGT) probe test device for sediment core in l2023
Radio frequency (RF) transistor amplifier packages with improved isolation and l2023
Rolling elements-based pivoting supports for keyboards2022
Trench MOSFET and method for manufacturing the same2022