Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

US Patent 7286278 · Granted Oct 23, 2007

Estimated economic value: $22,794,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

High-resolution pseudo-random dots projector module for depth sensing2024
3D camera using flash with structured light2016
Bump button2016
Micromirror array assembly2016
Micromirror array assembly2016
Bump button2015
3D camera using flash with structured light2014
Micromirror array assembly with in-array pillars2014
Micromirror array assembly with in-array pillars2014
Color light combiner2014
Bump validation2013
Bump suppression2013