Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Underfill composition and packaged solid state device

Underfill composition and packaged solid state device

US Patent 7279223 · Granted Oct 9, 2007

Estimated economic value: $50,041,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Device, method and system for providing recessed interconnect structures of a su2022
Integrated circuit package with through void guard trace2022
Turbine component surface cooling system with passive flow modulation2019
Cell culture support and associated method for cell growth and release2018
Fluid sensor cable assembly, system, and method2018
Thermal actuator including fluid with high temperature stability2017
Methods of preparing polysilazane resin with low halogen content2017
Method for curing of green polysilazane-based silicon carbide precursor fibers2017
Cell culture support and associated method for cell growth and release2016
Cell carrier, methods of making and use2016
Methods of making cell carrier2016
Methods and apparatus for crosslinking a silicon carbide fiber precursor polymer2016