Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Pasted SOI substrate, process for producing the same and semiconductor device

Pasted SOI substrate, process for producing the same and semiconductor device

US Patent 7253082 · Granted Aug 7, 2007

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Epitaxial wafer and method of producing the same2013
Heat treatment jig for semiconductor silicon substrates and method for manufactu2012
Epitaxial wafer and method of producing the same2011
Method for producing strained Si-SOI substrate and strained Si-SOI substrate pro2011
Method for manufacturing semiconductor wafer including a strained silicon layer2010
Manufacturing method for SIMOX substrate2009
Heat treatment jig for semiconductor silicon substrate2008
Heat treatment jig for semiconductor wafer2008
Heat treatment jig for semiconductor substrate2008
Heat treatment jig for silicon semiconductor substrate2007
Heat treatment jig for semiconductor silicon substrate2007
SOI substrate and manufacturing method thereof2005