Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Embedded on-die laser source and optical interconnect

Embedded on-die laser source and optical interconnect

US Patent 7251389 · Granted Jul 31, 2007

Estimated economic value: $23,850,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Flip-chip bumping metal layer and bump structure2025
Thermal compression flip chip bump for high performance and fine pitch2024
Package comprising spacers between integrated devices2024
Integrated circuit device structures and double-sided electrical testing2023
Integrated device comprising pillar interconnect with cavity2023
Sidewall wetting barrier for conductive pillars2023
Film bulk acoustic resonator (FBAR) devices for high frequency RF filters2023
Light curable composition2023
Photo-curable liquid optically clear adhesive composition and the use thereof2023
Flip-chip flexible under bump metallization size2023
RF filters and resonators of crystalline III-N films2023
Integrated circuit (IC) packages employing a thermal conductive package substrat2022