Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package and method for fabricating the same

Semiconductor package and method for fabricating the same

US Patent 7190071 · Granted Mar 13, 2007

Estimated economic value: $16,300,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Modular mainframe layout for supporting multiple semiconductor process modules o2025
Method for collective dishing of singulated dies2025
Package core assembly and fabrication methods2025
Reconstituted substrate structure and fabrication methods for heterogeneous pack2025
Package core assembly and fabrication methods2024
Modular mainframe layout for supporting multiple semiconductor process modules o2024
Modular mainframe layout for supporting multiple semiconductor process modules o2024
Package structure and fabrication methods2024
Package core assembly and fabrication methods2024
Package core assembly and fabrication methods2024
Reconstituted substrate structure and fabrication methods for heterogeneous pack2023
Package structure and fabrication methods2022