Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of forming a conductive structure

Method of forming a conductive structure

US Patent 7118998 · Granted Oct 10, 2006

Estimated economic value: $8,434,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method and apparatus for preventing unwanted code execution2015
System and method for providing a poly cap and a no field oxide area to prevent 2011
System and method for providing a buried thin film resistor having end caps defi2010
System and method for providing a nitride cap over a polysilicon filled trench t2010
Method of forming a silicide bridged anti-fuse with a tungsten plug metalization2009
Method of forming a silicide bridged anti-fuse with a tungsten plug metalization2009
System and method for providing a poly cap and a no field oxide area to prevent 2009
System and method for controlling the formation of an interfacial oxide layer in2008
System and method for controlling the formation of an interfacial oxide layer in2008
System and method for providing a buried thin film resistor having end caps defi2008
System and method for selectively modifying a wet etch rate in a large area2007
Method of forming a conductive structure in a semiconductor material2005