Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Structure and method for contact pads having a protected bondable metal plug over copper-metallized integrated circuits

Structure and method for contact pads having a protected bondable metal plug over copper-metallized integrated circuits

US Patent 7061114 · Granted Jun 13, 2006

Estimated economic value: $9,528,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Fast calibration test system and method for phased-array antenna2025
Route sending method and device2025
Structure for evenly applying forces on a heat dissipation base2025
Text processing method and apparatus, device, and medium2025
Filtering sensitive data in cloud native application logs2025
Method and apparatus for adding video effect, device, and storage medium2025
Policy transmission method and apparatus, and network transmission system2025
Treatment method using a complex of angiotensin II receptor antagonist metabolit2025
Image morphing adaption method and apparatus2025
Method for removing sacrificial layers of a stack of a three-dimensional semicon2025
Virtual machine management2025
Localization method and apparatus, electronic device, and storage medium2025