Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for removing sacrificial layers of a stack of a three-dimensional semiconductor structure in two steps

Method for removing sacrificial layers of a stack of a three-dimensional semiconductor structure in two steps

US Patent 12453094 · Granted Oct 21, 2025

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Check valve and scroll compressor2025
Test device and test method for rigid-flexible characteristics of rigid-flexible2025
Data storage method and system, and processor2025
Fast calibration test system and method for phased-array antenna2025
Three-dimensional memory device and method of forming the same2025
Three-dimensional NAND memory device having word line contact with dielectric fi2025
Conveyor belt lifting mechanism and online operation and maintenance robot for p2025
Route sending method and device2025
Structure for evenly applying forces on a heat dissipation base2025
3D memory device2025
Projection method and system, and device2025
Memory system, semiconductor device and fabrication method therefor2025