Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device

Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device

US Patent 7057266 · Granted Jun 6, 2006

Estimated economic value: $120,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Thermoplastic resin composition for semiconductor, adhesion film, lead frame, an2010
Resin composition, heat-resistant resin paste and semiconductor device using the2009
Adhesive film for semiconductor, lead frame and semiconductor device using the s2009
Adhesive film for semiconductor, lead frame and semiconductor device using the s2009
Adhesive film for semiconductor, metal sheet with such adhesive film, wiring sub2008
Adhesive film for semiconductor, metal sheet with such adhesive film, wiring sub2008
Adhesive film for semiconductor, lead frame and semiconductor device using the s2008
Adhesive film for semiconductor, lead frame and semiconductor device using the s2008
Resin composition, heat-resistant resin paste and semiconductor device using the2006
Photosensitive resin composition, process of forming patterns with the same, and2005
Adhesive film for semiconductor, lead frame and semiconductor device using the s2004
Adhesive film for semiconductor, lead frame with adhesive film for semiconductor2004