Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of performing back-end manufacturing of an integrated circuit device

Method of performing back-end manufacturing of an integrated circuit device

US Patent 7045387 · Granted May 16, 2006

Estimated economic value: $2,473,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Fingerprint sensor packages2025
Hydrogen barriers in a copper interconnect process2017
Semiconductor packaging identifier2016
Semiconductor packaging identifier2015
Multiple die paddle leadframe and semiconductor device package2013
Integrated circuit package with electrically isolated leads2012
Programmable floating gate reference2012
Warpage-compensating die paddle design for high thermal-mismatched package const2011
Flip-flop semiconductor device packaging using an interposer2011
Semiconductor device packaging using etched leadfingers2011
System for controlling the processing of an integrated circuit chip assembly lin2010
Integrated back-end integrated circuit manufacturing assembly2010