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Home › Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool

Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool

US Patent 7030018 · Granted Apr 18, 2006

Estimated economic value: $19,456,000 ⓘ

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