Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Insulated bonding wire tool for microelectronic packaging

Insulated bonding wire tool for microelectronic packaging

US Patent 6991147 · Granted Jan 31, 2006

Estimated economic value: $10,259,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

3D-interconnect2024
3D-interconnect2021
3D-interconnect2019
Low cost hybrid high density package2018
Low cost hybrid high density package2016
Low cost hybrid high density package2015
Flip-chip QFN structure using etched lead frame2013
Area array quad flat no-lead (QFN) package2013
Enhanced pad design for solder attach devices2012
Semiconductor package and method using isolated VSS plane to accommodate high sp2012
Wire bond integrated circuit package for high speed I/O2010
Semiconductor package and method using isolated Vss plane to accommodate high sp2010