Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › 3D-interconnect

3D-interconnect

US Patent 11031362 · Granted Jun 8, 2021

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

3D-interconnect2025
3D-interconnect2025
Method of forming a region shielding within a package of a microelectronic devic2025
3D-interconnect with electromagnetic interference (“EMI”) shield and/or antenna2024
Region shielding within a package of a microelectronic device2024
3D-interconnect2024
3D-interconnect2024
3D-interconnect2024
3D-interconnect2019
3D-interconnect2019
3D-interconnect2019
Low cost hybrid high density package2018