Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Thermally enhanced cavity-down integrated circuit package

Thermally enhanced cavity-down integrated circuit package

US Patent 6984785 · Granted Jan 10, 2006

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Bulk bag2023
Bulk bag with reduced midbody circumference2018
Circuit board with corner hollows2018
Circuit board with via trace connection and method of making the same2017
Semiconductor chip package with undermount passive devices2017
Method of fabricating an integrated circuit (IC) package having a plurality of s2016
Ball grid array package with improved thermal characteristics2016
Methods of fabricating semiconductor chip solder structures2016
Methods of fabricating semiconductor chip solder structures2015
Integrated circuit package strip with stiffener2014
Wafer level packaging of semiconductor chips2014
Thermal management of stacked semiconductor chips with electrically non-function2014