Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Structure and method for latchup suppression utilizing trench and masked sub-collector implantation

Structure and method for latchup suppression utilizing trench and masked sub-collector implantation

US Patent 6956266 · Granted Oct 18, 2005

Estimated economic value: $9,308,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Foaming behaviour of polymer compositions using passive nucleation2025
Structure and method of latchup robustness with placement of through wafer via w2021
Method for forming FinFET device structure2020
Structure and method of latchup robustness with placement of through wafer via w2019
FinFET device structure and method for forming same2018
Structure and method of latchup robustness with placement of through wafer via w2017
Structure and method of latchup robustness with placement of through wafer via w2016
Structure and method of latchup robustness with placement of through wafer via w2016
Si and SiGeC on a buried oxide layer on a substrate2015
Structure, structure and method of latch-up immunity for high and low voltage in2015
ESD network circuit with a through wafer via structure and a method of manufactu2015
Structure, structure and method of latch-up immunity for high and low voltage in2015