Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of forming semiconductor device with non-conformal liner layer that is thinner on sidewall surfaces

Method of forming semiconductor device with non-conformal liner layer that is thinner on sidewall surfaces

US Patent 6943098 · Granted Sep 13, 2005

Estimated economic value: $68,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device and method of manufacture2021
Semiconductor device and method of manufacture2021
Foldable stand2017
Two-step GC etch for GC profile and process window improvement2006
Semiconductor device and manufacturing method thereof2005
Method of deep contact fill and planarization for dual damascene structures2004
Method for forming contacts2003
Method for forming contacts2003