Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and apparatus for pretreating a substrate prior to electroplating

Method and apparatus for pretreating a substrate prior to electroplating

US Patent 6941957 · Granted Sep 13, 2005

Estimated economic value: $3,131,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device and method forming the same2024
Package structure and method for manufacturing the same2024
Method of forming dice and structure of die2023
High-efficiency packaged chip structure and electronic device including the same2023
Method of forming dice and structure of die2022
Fabrication method of flexible electronic device2021
Fixing device for fixing data processor2021
Semiconductor structure and manufacturing method thereof2020
Interconnect structure and manufacturing method thereof2018
Chip package with thermal dissipation structure and method for forming the same2018
Carrier for hard disk drive2017
Carrier for hard disk drive2017