Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wafer scale package and method of assembly

Wafer scale package and method of assembly

US Patent 6939784 · Granted Sep 6, 2005

Estimated economic value: $10,948,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Articulating spacecraft chassis2025
Latch mechanism2025
Tray and electronic device using the same2025
Lockable handle assembly with floating cam mechanism2024
Mount assembly for add-in card, electronic device, and chassis2022
Handle device, chassis and server2022
Geospatial imaging system providing segmentation and classification features and2017
Systems and methods for maximizing breakdown voltage in semiconductor devices2012
Method of manufacturing a micro-electrical-mechanical system with thermally isol2011
Systems and methods for maximizing breakdown voltage in semiconductor devices2010
Can-style wireless bridge2009
Method of making a self aligned ion implanted gate and guard ring structure for 2009