Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12289856 | Tray and electronic device using the same | Yu-Chen Lin, Ching-Hao Chen | 2025-04-29 |
| 11337343 | Mount assembly for add-in card, electronic device, and chassis | Jun Wang, Tai-Hsun Wu | 2022-05-17 |
| 11229134 | Handle device, chassis and server | Ching-Hao Chen, Yu-Chen Lin, Tai-Hsun Wu, Jun Wang | 2022-01-18 |
| 8110494 | Systems and methods for maximizing breakdown voltage in semiconductor devices | John V. Veliadis, Eric J. Stewart, Megan Jean McCoy, Ty R. McNutt | 2012-02-07 |
| 7667242 | Systems and methods for maximizing breakdown voltage in semiconductor devices | John V. Veliadis, Eric J. Stewart, Megan Jean McCoy, Ty R. McNutt | 2010-02-23 |
| D598020 | Can-style wireless bridge | Ming-Yih Lu, Han-Chung Chang, Chih-Hsin Chen | 2009-08-11 |
| 7547586 | Method of making a self aligned ion implanted gate and guard ring structure for use in a sit | — | 2009-06-16 |
| 7372087 | Semiconductor structure for use in a static induction transistor having improved gate-to-drain breakdown voltage | Victor Veliadis | 2008-05-13 |
| 6939784 | Wafer scale package and method of assembly | Philip C. Smith, Thomas Moloney, Howard Fudem | 2005-09-06 |
| 6812558 | Wafer scale package and method of assembly | Philip C. Smith, Thomas Moloney, Howard Fudem | 2004-11-02 |
| 6777765 | Capacitive type microelectromechanical RF switch | Howard Fudem, Donald E. Crockett, III, Philip C. Smith | 2004-08-17 |
| 5851852 | Die attached process for SiC | John A. Ostop | 1998-12-22 |
| 5807773 | Self-aligned gate fabrication process for silicon carbide static induction transistors | Rowland C. Clarke, Richard R. Siergiej | 1998-09-15 |
| 5369040 | Method of making transparent polysilicon gate for imaging arrays | James Halvis, Nathan Bluzer, Robert R. Shiskowski | 1994-11-29 |
| 5110755 | Process for forming a component insulator on a silicon substrate | Rathindra N. Ghoshtagore, Alfred P. Turley, Louis A. Yannone | 1992-05-05 |