Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Flat leadframe for a semiconductor package

Flat leadframe for a semiconductor package

US Patent 6885088 · Granted Apr 26, 2005

Estimated economic value: $3,285,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Flexible clip with aligner structure2025
Semiconductor device modules2025
SiC MOSFET semiconductor packages and related methods2025
Power module package2025
Power module package2025
Semiconductor packages using package in package systems and related methods2025
Power module package for direct cooling multiple power modules2025
High power module package structures2025
Dual side direct cooling semiconductor package2025
Immersion direct cooling modules2025
Submodule semiconductor package2025
Package including multiple semiconductor devices2024