Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Lead frame and production process thereof and production process of thermally conductive substrate

Lead frame and production process thereof and production process of thermally conductive substrate

US Patent 6870244 · Granted Mar 22, 2005

Estimated economic value: $203,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Aqueous ink, ink cartridge and ink jet recording method2025
Prospective client intake and assignment system2024
Tactile sensor that includes two sheets each having at least either flexibility 2019
Flexible touch sensor and method of manufacturing the same2019
Ink, ink cartridge, and ink jet recording method2018
Conductive paste for forming conductive film for semiconductor devices, semicond2018
Ink, ink cartridge, and ink jet recording method2018
Ink, ink cartridge, and ink jet recording method2018
Flexible substrate including stretchable sheet2017
Electronic component package and method for manufacturing the same2017
Electronic component package and method for manufacturing the same2017
Resin vehicle part manufacturing method and resin vehicle part2017