{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Injection mold for an optical semiconductor package and corresponding optical semiconductor package", "item": "https://www.patentleaderboard.com/patent/6858933"}]}
Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Injection mold for an optical semiconductor package and corresponding optical semiconductor package

Injection mold for an optical semiconductor package and corresponding optical semiconductor package

US Patent 6858933 · Granted Feb 22, 2005

Estimated economic value: $7,598,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Integrated circuit package system with wire-in-film isolation barrier and method2013
Integrated circuit package system with wire-in-film isolation barrier2011
Optical die-down quad flat non-leaded package2010
Optical die-down quad flat non-leaded package2009
Integrated circuit chip support substrate for placing in a mold, and associated 2007
Sensor semiconductor package, provided with an insert, and method for making sam2006
Method for making a semiconductor package and semiconductor package with integra2006
Method of fabricating an optical semiconductor package and optical semiconductor2006
Optical semiconductor device and method of manufacture2005
Flat leadframe for a semiconductor package2005
Semiconductor package with a sensor having a fastening insert2004
Mold for flashless injection molding to encapsulate an integrated circuit chip2004