Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8415810 | Integrated circuit package system with wire-in-film isolation barrier and method for manufacturing thereof | — | 2013-04-09 |
| 7994645 | Integrated circuit package system with wire-in-film isolation barrier | — | 2011-08-09 |
| 7736930 | Optical die-down quad flat non-leaded package | — | 2010-06-15 |
| 7495325 | Optical die-down quad flat non-leaded package | — | 2009-02-24 |
| 6858933 | Injection mold for an optical semiconductor package and corresponding optical semiconductor package | Christophe Prior | 2005-02-22 |
| 6696006 | Mold for flashless injection molding to encapsulate an integrated circuit chip | Remi Brechignac | 2004-02-24 |