{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Laminated socket contacts", "item": "https://www.patentleaderboard.com/patent/6854979"}]}
Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Laminated socket contacts

Laminated socket contacts

US Patent 6854979 · Granted Feb 15, 2005

Estimated economic value: $22,930,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method and apparatus for identification of fetal cross-sections based on ultraso2025
Pitch translation architecture for semiconductor package including embedded inte2025
Interconnect architecture with silicon interposer and EMIB2025
IC die and heat spreaders with solderable thermal interface structures for multi2025
Mold shelf package design and process flow for advanced package architectures2025
Microelectronic component having molded regions with through-mold vias2024
No mold shelf package design and process flow for advanced package architectures2024
Pitch translation architecture for semiconductor package including embedded inte2024
IC die and heat spreaders with solderable thermal interface structures for assem2024
IC die and heat spreaders with solderable thermal interface structures for multi2024
IC die with solderable thermal interface structures for assemblies including sol2024
Interconnect architecture with silicon interposer and EMIB2024