{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Method and apparatus for measuring the shape and thickness variation of polished opaque plates", "item": "https://www.patentleaderboard.com/patent/6847458"}]}
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Home › Method and apparatus for measuring the shape and thickness variation of polished opaque plates

Method and apparatus for measuring the shape and thickness variation of polished opaque plates

US Patent 6847458 · Granted Jan 25, 2005

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