Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multi-chip semiconductor package and fabrication method thereof

Multi-chip semiconductor package and fabrication method thereof

US Patent 6825064 · Granted Nov 30, 2004

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Manufacturing method of flip chip package structure2025
High electron mobility transistor2025
Semiconductor structure2025
High electron mobility transistor and method of forming the same2024
Magnetic tunnel junction device and method of forming same2024
Semiconductor device with strain relaxed layer2024
Semiconductor device with strain relaxed layer2024
Magnetic tunnel junction device and method of forming same2024
Semiconductor package having improved thermal interface between semiconductor di2024
Flip chip package structure and manufacturing method thereof2024
Semiconductor device with strain relaxed layer2024
Semiconductor package with EMI shielding structure2024