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Home › In-situ plasma ash/treatment after via etch of low-k films for poison-free dual damascene trench patterning

In-situ plasma ash/treatment after via etch of low-k films for poison-free dual damascene trench patterning

US Patent 6797633 · Granted Sep 28, 2004

Estimated economic value: $12,669,000 ⓘ

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