Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for reducing by-product deposition in wafer processing equipment

Method for reducing by-product deposition in wafer processing equipment

US Patent 6794308 · Granted Sep 21, 2004

Estimated economic value: $15,953,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Substrate processing apparatus, method of processing substrate, method of manufa2025
Air cushioning material2024
Method of manufacturing semiconductor device, and recording medium2024
Method of manufacturing semiconductor device, and recording medium2021
Method of forming tungsten film2021
Method of forming a tungsten film having a low resistance2020
Semiconductor device and manufacturing method thereof2019
Substrate processing method and substrate processing apparatus2019
Semiconductor device and manufacturing method thereof2018
Fixing apparatus and image forming apparatus including a covering unit with a mo2018
Method of manufacturing semiconductor device2018
Method of manufacturing semiconductor device2018