Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Heating device for heating semiconductor wafers in thermal processing chambers

Heating device for heating semiconductor wafers in thermal processing chambers

US Patent 6771895 · Granted Aug 3, 2004

Estimated economic value: $3,011,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Heating device for heating semiconductor wafers in thermal processing chambers2012
Heating device for heating semiconductor wafers in thermal processing chambers2012
Heating device for heating semiconductor wafers in thermal processing chambers2009
Heating device for heating semiconductor wafers in thermal processing chambers2009
Fast heating and cooling apparatus for semiconductor wafers2007
Heating device for heating semiconductor wafers in thermal processing chambers2006
Heating device for heating semiconductor wafers in thermal processing chambers2006
Method for rapidly heating and cooling semiconductor wafers2005
Rapid thermal processing chamber for processing multiple wafers2004
Heating device for heating semiconductor wafers in thermal processing chambers2004
Heating device for heating semiconductor wafers in thermal processing chambers2004
Rapid thermal processing chamber for processing multiple wafers2003