Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multi-pixel methods and apparatus for analysis of defect information from test structures on semiconductor devices

Multi-pixel methods and apparatus for analysis of defect information from test structures on semiconductor devices

US Patent 6771806 · Granted Aug 3, 2004

Estimated economic value: $12,130,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Methods and systems for defects detection and classification using X-rays2025
Methods and systems for detecting defects in devices using X-rays2023
Methods and systems for printed circuit board design based on automatic correcti2023
Methods and systems for manufacturing printed circuit board based on x-ray inspe2023
X-ray photoemission system for 3-D laminography2023
Methods and systems for product failure prediction based on X-ray image re-exami2023
Methods and systems for process control based on X-ray inspection2022
Devices processed using x-rays2022
X-ray photoemission apparatus for inspection of integrated devices2022
Super-resolution x-ray imaging method and apparatus2021
Methods and systems for printed circuit board design based on automatic correcti2021
Prediction based chucking and lithography control optimization2020