Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Single unit automated assembly of flex enhanced ball grid array packages

Single unit automated assembly of flex enhanced ball grid array packages

US Patent 6759752 · Granted Jul 6, 2004

Estimated economic value: $67,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Molded silicon on passive package2024
Selectable monolithic or external scalable die-to-die interconnection system met2024
Flexible package architecture concept in fanout2024
Selectable monolithic or external scalable die-to-die interconnection system met2024
Die stitching and harvesting of arrayed structures2023
Wafer-level passive array packaging2022
Laser-assisted cleaving of a reconstituted wafer for stacked die assemblies2014
Laser-assisted cleaving of a reconstituted wafer for stacked die assemblies2013
System and method for increased stand-off height in stud bumping process2009
Flip chip molded/exposed die process and package structure2006
Enhanced BGA grounded heatsink2004
Testing of BGA and other CSP packages using probing techniques2004