Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Flip-chip package integrating optical and electrical devices and coupling to a waveguide on a board

Flip-chip package integrating optical and electrical devices and coupling to a waveguide on a board

US Patent 6754407 · Granted Jun 22, 2004

Estimated economic value: $27,859,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Ferroelectrically modulated spin orbit logic device2025
Microelectronic assemblies with communication networks2025
Packaging architecture with intermediate routing layers2025
Cooling of conformal power delivery structures2025
Contactless communication using a waveguide extending through a substrate core2025
Differentially programmable magnetic tunnel junction device and system including2025
Perovskite-based magnetoelectric spin-orbit logic devices2025
Fine-grained disaggregated server architecture2025
Device, method and system to mitigate stress on hybrid bonds in a multi-tier arr2025
Magnetoelectric spin-orbit device with in-plane and perpendicular magnetic layer2025
Piezo-resistive resonator device having drive and sense transistors with wells o2025
Capacitor with an electrically conductive layer coupled with a metal layer of th2025