Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and system for universal packaging in conjunction with a back-end integrated circuit manufacturing process

Method and system for universal packaging in conjunction with a back-end integrated circuit manufacturing process

US Patent 6730532 · Granted May 4, 2004

Estimated economic value: $3,309,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Fingerprint sensor packages2025
Semiconductor packaging identifier2016
Semiconductor packaging identifier2015
Multiple die paddle leadframe and semiconductor device package2013
Two-sided die in a four-sided leadframe based package2013
Method of fabricating a two-sided die in a four-sided leadframe based package2013
Integrated circuit package with electrically isolated leads2012
Method of fabricating a two-sided die in a four-sided leadframe based package2011
Warpage-compensating die paddle design for high thermal-mismatched package const2011
Flip-flop semiconductor device packaging using an interposer2011
Semiconductor device packaging using etched leadfingers2011
System for controlling the processing of an integrated circuit chip assembly lin2010