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Home › Method for manipulating MEMS devices, integrated on a wafer semiconductor and intended to be diced one from the other, and relevant support

Method for manipulating MEMS devices, integrated on a wafer semiconductor and intended to be diced one from the other, and relevant support

US Patent 6696364 · Granted Feb 24, 2004

Estimated economic value: $13,147,000 ⓘ

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