Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and apparatus for processing substrates in a system having high and low pressure areas

Method and apparatus for processing substrates in a system having high and low pressure areas

US Patent 6672864 · Granted Jan 6, 2004

Estimated economic value: $45,040,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Magnetic thin film laminated structure and micro-inductive device thereof2025
Method and system for dynamic stability control of power systems with renewable 2025
Submodule hybrid MMC with low full-bridge ratio and DC fault processing method t2024
Resistive sub-module hybrid MMC and direct current fault processing strategy the2024
Distributed voltage clamping method for 100% renewable-energy sending-end grid2024
Offshore wind farm low-frequency alternating-current uncontrolled rectification 2024
Backup voltage and frequency support method for 100%-renewable energy sending-en2024
High-frequency uncontrolled rectifier-based DC transmission system for offshore 2023
Magnetic thin film laminated structure deposition method2023
Grid-forming wind turbine control method for diode rectifier unit-based offshore2023
Control method for a parallel MMC unit of a LCC-MMC hybrid cascade converter sta2023
Degassing chamber and semiconductor processing apparatus2022